Fluorocarbon cooling medium Description
Fluorocarbon-cooled working fluids are high-permeability, high- permeability perfluorinated liquid compounds with high dielectric constant, ideal chemical inertness, excellent thermal conductivity, and good system matching compatibility. This series of products are widely used in various temperature-controlled heat dissipation systems. This product is widely used in immersed phase liquid cooling of data center servers, and is also widely used in various stages of semiconductor manufacturing to cool and cool (such as wafer manufacturing coolers, dry Etching and tempering upper and lower electrodes for temperature control, wafer pattern preparation, exposure table, and wafer test system.
High and low temperature cooling control, etc.; high-speed train power supply inverter, lithium battery power car cooling temperature control, nuclear power, UHV power grid and military radar system, wind turbine internal heating components cooling system cooling and cooling.
Fluorocarbon cooling medium Features
Ideal chemical inertness, can be widely used in various temperature control heat dissipation occasions.
Single-phase cooling has a lower gas pressure, which can reduce the sealing requirements of the equipment and the maintenance in the later maintenance, and reduce the cost.
Non-dangerous goods or not explosion, no flash point
Electrical insulation is good, with a very high breakdown voltage greater than 50KV.
A dielectric constant below 2 does not deplete data in data center applications.
Good fluidity, low viscosity compared to clean water; good heat dissipation in temperature control systems.
Non-toxic, harmless and non-irritating
Fluorocarbon cooling medium Typical Properties
Dielectric constant | 1.85 |
Breakdown voltage Content measurement) | 48KV |
Surface Tension | 16.7mN/m |
Boiling point | 110~115°C |
Density | 1.812g/ml |
Volume resistivity | 1.4×1014 |
Coefficient of expansion | 0.0015 |
Saturated water content | 23.4ppm |
Critical temperature | —— |
PH value | —— |
Flash point | N/A |
Burning process | N/A |
ODP | 0 |
GWP | Low |
Specific heat (25 ° C) | 1.431J/g°C |
Thermal Conductivity | 0.0831 |
Heat of vaporization | 136J/g°C |
Viscosity | 0.87 mPa.s |
HH-705 Description
Cooling Medium HH-705 is a highly stable fluoroether liquid with high dielectric strength, ideal chemical inertness, excellent heat transfer properties and good system compatibility. This product is widely used in various temperature control cooling systems, such as heat pipe cooling system (soaking plate, inflation plate and various types of heat pipe radiators), lithium battery power vehicles (motor, battery box, etc.) Cooling and cooling in all aspects of production and manufacturing (such as wafer manufacturing cooler, dry etching upper and lower electrode cooling temperature control, chip pattern preparation exposure machine, chip test system high and low temperature cooling control, chip sorting equipment, etc.), military Cooling and cooling of the heat dissipation system of the internal heating components of the radar system and the wind power generator.
HH-705 Features
It has good chemical inertness, it can be widely used in various temperature controlled heat dissipation applications.
Non-dangerous goods, no explosion, no flash point
Good electrical insulation, with a very high breakdown voltage greater than 40KV。
Low viscosity, good heat dissipation in the temperature control system.
Non-toxic, harmless and non-irritating
Environmentally friendly, with 0 ODP values and very low GWP value products
HH-705 Typical Properties
Name | HH-705 | Dielectric constant | 5.82 |
Dielectric strength | >40KV | Surface Tension | 1.154mN/m |
Boiling point | 73°C | density | 1.52g/ml |
Specific heat capacity | 137.5J/g°C | Vaporization heat | 132.7J/g°C |
Saturated water content | 647ppm | Viscosity | 0.61 CPS |
PH | Not applicable | Flash point | N/A |
Combustion process; | N/A | ODP | 0 |
GWP | 33 | Vapor Pressure 20℃ | 13kpa |
Fluorocarbon alkane solvent Usage
Solvent: anti-fingerprint liquid and lubricant thinner
Cleaning: metal degreasing cleaning, plastic cleaning, resin cleaning, dust
removal
Heat medium: secondary refrigerant, cold load
Used to replace 3MTM NovecTM, & DupontTM Vertrel® solvents
Fluorocarbon alkane solvent Advantages
Colorless, odorless, not burning
Low surface tension, low viscosity, low latent heat of evaporation
Excellent heat resistance, chemical resistance and hydrolysis resistance
The performance is closest to CFCs and the ODP value is zero
Fluorocarbon alkane solvent Typical Properties
Boiling point | 90-110℃ |
density | 1.766(g/ml,25℃) |
Viscosity | 0.62(cst) |
Vapor Pressure | 6(KPa, 25℃) |
Perfluoro-n-heptane | ≈27% |
Perfluoropropylcyclohexyl ether | ≈6% |
Perfluorobutylcyclop entyl ether | ≈36% |
Perfluoro-n-octane | ≈23% |
Perfluorocyclodecyl ether | ≈1.5% |
Moisture | <50ppm |
Hexafluoropropylene trimer Usage
Solvent: lubricant diluent
Cleaning: metal degreasing cleaning, plastic cleaning, resin cleaning, dust removal
Synthetic surfactants and polymers
Heat medium: secondary refrigerant, carrying cold
Used to replace 3MTM NovecTM, & DupontTM Vertrel® solvents
Hexafluoropropylene trimer Advantages
Colorless, odorless, not burning
Low surface tension, low viscosity, low latent heat of evaporation
Excellent heat resistance, chemical resistance and hydrolysis resistance
The performance is closest to CFCs and the ODP value is zero
Hexafluoropropylene trimer Typical Properties
Boiling point | 108 ℃ |
density | 1.75 (g/ml,25℃) |
Viscosity | 0.68 (cst) |
Vapor Pressure | 5.5 (KPa,25℃) |
Surface Tension | 13(dyn/cm) |
content | >99% |